LAS VEGAS, January 6, 2026 – SK hynix Inc., a global leader in memory solutions, today inaugurated its dedicated customer exhibition at CES 2026, placing next-generation AI memory innovation at the forefront. Under the theme \”Innovative AI, Sustainable Tomorrow,\” the showcase underscores the company\’s commitment to co-creating the essential memory infrastructure for the accelerating AI era.
Moving beyond a joint group booth, SK hynix is focusing this year on deepening engagement with key clients, transforming the space into a hub for collaboration on next-gen AI hardware.
The Next Leap in High-Bandwidth Memory
The centerpiece of the exhibition is the debut of its 16-layer HBM4 product with 48GB capacity. This next-generation HBM builds upon the groundbreaking 12-layer HBM4 (36GB), which set an industry speed record of 11.7Gbps. The new prototype, aligned with key customer development roadmaps, represents the forthcoming standard for ultra-high-performance AI accelerator memory.
Alongside this future tech, SK hynix is showcasing the 12-layer HBM3E product (36GB), poised to drive the AI server market this year. Demonstrations will feature operational GPU modules utilizing this HBM3E, highlighting its critical role within live AI computing systems.
A Full-Spectrum AI Memory Portfolio
The company is demonstrating a comprehensive strategy to address the exploding demand for AI server infrastructure. Beyond HBM, it is presenting SOCAMM2, a low-power memory module specifically engineered for AI servers, showcasing an optimized solution for power-conscious data centers.
The innovation extends across its entire lineup. For on-device AI, SK hynix is unveiling LPDDR6, delivering substantially enhanced data processing speeds and superior power efficiency over its predecessors. In response to AI data centers\’ hunger for massive storage, the company is exhibiting its 321-layer 2Tb QLC NAND flash. With best-in-class density, this product offers significant gains in performance and power efficiency for ultra-high-capacity enterprise SSDs.
Experiencing the AI Memory Ecosystem of Tomorrow
An interactive \’AI System Demo Zone\’ offers a glimpse into the future of memory-centric computing. This zone features pioneering concepts where memory takes a more active role, including:
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cHBM (Custom HBM): Tailored for specific AI chips/systems, with a large-scale mock-up revealing its innovative integrated architecture.
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PIM-based AiMX & CuD: Solutions that perform computation directly within the memory unit.
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CMM-Ax: CXL memory with integrated computing capabilities.
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Data-aware CSD: Context-aware storage devices.
These technologies visualize a paradigm shift where functions traditionally handled by GPUs or ASICs are integrated into memory itself, targeting superior inference efficiency and total cost of ownership.
Executive Insight
\”As AI-driven innovation accelerates, our customers\’ technical requirements are evolving at an unprecedented pace,\” said Justin Kim, President & Head of AI Infra at SK hynix. \”We are responding with a portfolio of differentiated memory solutions. Through deep collaboration, we are dedicated to creating new value and propelling the entire AI ecosystem forward.\”
Visit SK hynix at CES 2026 (January 6-9) at the Venetian Expo to explore the memory solutions powering the next wave of artificial intelligence.
